Deposition Equipment

The Veeco atomic layer deposition (ALD) system can deposit atomically thin films with high conformality. The ALD process typically employs two chemicals to create atomically thin films, resulting in features such as conformality, uniformity, repeatability, and accurate thickness control. ALD films can be deposited at temperatures up to 400 oC. Currently, IMSE provides Al2O3 and HfO2 films.

SOP 

IMSE contact

For additional information about the ALD or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The AJA International electron beam evaporation system can deposit materials for applications requiring high purity film and/or film growth directionality. Deposition growth rates: 0.01 to 0.4 nm/s. Currently, materials are limited to: Al, AlO2, Nb, and Ti. Oxygen gas is available.

SOP

IMSE contact

For additional information about the AJA evaporator or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Kurt J. Lesker PVD 75 is a 4-pocket electron-beam evaporation thin film deposition system. The system can accommodate substrates up to 150 mm in size and rotation up to 20 rpm. Currently, IMSE provides Al, Cr, Cu, Au, and Ti.

SOP

IMSE contact

For additional information about the PVD 75 electron beam evaporator or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Edwards Auto 306 Vacuum coater is a thermal evaporation system.

SOP

IMSE contact

For additional information about the Edwards thermal evaporator or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Kurt J. Lesker Nano 36 is a 4-pocket thermal evaporation thin film deposition system. The system can accommodate substrates up to 150 mm in size. Currently, IMSE provides Al, Cr, Cu, Au, and Ti. 

SOP

IMSE contact

For additional information about the Nano 36 thermal evaporator or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Kurt Lesker PVD 75 sputtering deposition system provides material deposition on substrates using DC or RF magnetron sputtering. Typical growth rates: 0.5 nm/s. Oxygen gas available. Currently, IMSE provides Al, SiO2, Nb, SiN, ZnO, Cu, Zn, and Ti.

Specifications

• RF (insulating materials) or DC (conductive material) deposition.
• Substrates up to 8 in
• Substrate heating to 300C

SOP

IMSE contact

For additional information about the sputter coater or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Oxford Instrument Nanofab plasma enhanced chemical vapor deposition (PECVD) system provides SiO2, Si3N4, and a-Si thin film deposition at temperatures up to 400 oC. Standard gases: Ar, N2O, N2, CH4, 2%SiH4 in Ar, NH3, and H2.

SOP

IMSE contact

For additional information about the PECVD or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Lindberg tube furnace is used to grow silicon dioxide (SiO2) on silicon substrates at temperatures up to 1100 oC. A batch of wafers (up to 25) can be run or smaller samples.

SOP

IMSE contact

For additional information about the tube furnace or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The SCS parylene deposition system can conformally deposit a uniform polymer film over a wide variety of substrates at room temperature. Currently, IMSE provides Parylene-C dimer.

SOP

IMSE contact

For additional information about the parylene deposition system or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu) 

The Denton Vacuum DESK-II DC sputtering system is a simple deposition system to deposit of metallic films. Deposition rates are typically 5 nm/min.

SOP

IMSE contact

For additional information about the Denton or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)