Packaging & Test Equipment

The Suss SB8 Gen2 is a semi-automated universal wafer bonding system that accommodates samples up to 200 mm in diameter. The SB8 supports adhesive and thermo-compression bonding, as well as fusion and eutectic bonding using the impulse current bonding (ICB) process. The SB8 enables bonding temperatures up to 550 oC with high temperature uniformity and repeatability. The chamber pressure can be controlled from vacuum to overpressure.

SOP

IMSE contact

For additional information about the Karl Suss SB8 or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Signatone S-1008 probe station is used to measure the electrical properties of microdevices by contacting microcontact pads patterned on a wafer with needle-sharp probe tips. 2-wire and 4-wire measurements can be performed using the Keithley 238 Source Measure Unit. An LCR 800 meter is also available for measuring additional electrical properties.

SOP

IMSE contact

For additional information about the probe station or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

2-wire and 4-wire DC measurements can be performed using the Keithley 238 Source Measure Unit.

IMSE contact

For additional information about the source measure unit or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The LCR 800 meter is also available for AC properties of microdevices using RC, RL, LC, and RLC models. 

IMSE contact

For additional information about the LCR meter or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Disco DAD323 dicing saw can be used to cut a variety of materials, such as silicon, glass, sapphire, and ceramics. The substrate size is limited to 150 mm in diameter and height < 5 mm. The instrument can operate in manual or automatic modes. IMSE provides standard blades for cutting most types of materials, and the cost is included in the instrument charges. Currently, IMSE staff are responsible for changing the blades for all users.

SOP

IMSE contact

For additional information about the dicing saw or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)

The Across vacuum oven provides temperatures up to 300 oC and pressures down 100 mTorr.

SOP

IMSE contact

For additional information about the vacuum oven or to request training, please contact IMSE cleanroom staff.

Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)