Micro Nano Fabrication
Etching Equipment
RIE | Oxford Instruments PlasmaLab System 100 ICP 180
The Oxford Instruments Plasma Lab 100 System is a dual source plasma: inductively coupled plasma (ICP) on the top chamber and reactive ion plasma source on the bottom electrode. The ICP provides deep reactive ion etching (DRIE) through wafer silicon etching. Standard gases: Ar, O2, H2, CF4, CHF3, and SF6.
IMSE contact
For additional information about the RIE or to request training, please contact IMSE cleanroom staff.
Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)
Asher | Plasma Etch PE-50
The Plasma Etch PE-50 Asher uses oxygen plasma to remove organic materials such as photoresist.
IMSE contact
For additional information about the asher or to request training, please contact IMSE cleanroom staff.
Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)
Wet Etching | Fixtures using in Acid Hood
Teflon samples are available for processing up to 4 in wafers, smaller pieces and photomask plates up to 5 in.
IMSE contact
For additional information about the wet etching fixtures or to request training, please contact IMSE cleanroom staff.
Dr. Rajinder Deol (deolr@wustl.edu)
Dr. Edwin Carlen (carlen@wustl.edu)