Education

MEMS 5611 Principles and Methods of Micro and Nanofabrication

A hands-on introduction to the fundamentals of micro and nanofabrication processes with emphasis on cleanroom practices. The physical principles of oxidation, optical lithography, thin film deposition, etching and metrology methods will be discussed, demonstrated and practiced. Students will be trained in cleanroom concepts and safety protocols. Sequential micro-fabrication processes involved in the manufacture of microelectronic and photonic devices will be shown. Training in imaging and characterization of micro- and nano-structures will be provided.

Credit: 3 units

Typical periods offered: Spring

MEMS 5801 Micro-Electro-Mechanical Systems I

Introduction to MEMS: Microelectromechanical systems (MEMS) are ubiquitous in chemical, biomedical, and industrial (e.g., automotive, aerospace, printing) applications. This course will cover important topics in MEMS design, micro-/nanofabrication, and their implementation in real-world devices. The course will include discussion of fabrication and measurement technologies (e.g., physical/chemical deposition, lithography, wet/dry etching, and packaging), as well as application of MEMS theory to design/fabrication of devices in a cleanroom. Lectures will cover specific processes and how those processes enable the structures needed for accelerometers, gyros, FR filters, digital mirrors, microfluidics, micro total-analysis systems, biomedical implants, etc. The laboratory component will allow students to investigate those processes first-hand by fabricating simple MEMS devices.

Credit: 3 units

Typical periods offered: Fall

ESE 4361 Semiconductor Fabrication Lab

This course provides a comprehensive, hands-on introduction to semiconductor processing, focusing on the design, layout, fabrication, and testing of semiconductor devices from start to finish. Throughout the semester, students will learn key techniques and principles in semiconductor device fabrication, including wafer preparation, thermal oxidation, photolithography, doping (activation and diffusion), deposition (CVD, PVD, and ALD), etching (wet and dry), annealing, passivation, and chemical mechanical polishing (CMP). The course highlights the critical role of plasma physics and chemistry in modern semiconductor manufacturing, covering topics such as reactive ion etching (RIE) and plasma-enhanced chemical vapor deposition (PECVD). In addition, students will gain hands-on experience with industry-standard simulation tools used in semiconductor design and analysis. Through a combination of lectures and weekly lab sessions, students will acquire practical experience in cleanroom environments, mastering the tools and processes required to create functional semiconductor devices. The course culminates in final presentations, where students will share their results and analysis.

Credit: 3 units

Typical periods offered: Spring